Diamond Metal Cutting Disc

Basic Composition: Generally, a diamond cutting slice is composed of two main parts: the base body and the cutting head. The base body is the main supporting part for bonding the cutting head, and it usually does not wear out during the using process. The cutting head is the part that plays the cutting role, which contains diamond particles. These particles are enclosed within the cutting head by materials like metals and are gradually consumed during use.
Process Classification
- Sintered Diamond Slices: It includes cold pressing sintering and hot pressing sintering processes. By sintering diamond particles and metal powders, etc. under a certain pressure and temperature to form a shape, the diamond particles are firmly embedded on the base body, which endows the slice with high hardness and wear resistance.
- Welded Diamond Slices: There are methods such as brazing and laser welding. Brazing is to connect the diamond cutting head and the base body together by using brazing filler metal, and laser welding is to achieve the welding through laser energy. The welded diamond slices have good bonding strength and cutting performance.
- Electroplated Diamond Slices: The diamond particles are coated on the surface of the base body by using the electroplating process. The diamond particles of this kind of slice are more evenly distributed, and it has good applications in some precision cutting fields.

High Hardness and Wear Resistance: Diamond is the hardest substance in nature. Therefore, diamond cutting slices have excellent cutting ability and can easily cut various hard and brittle materials, such as stone, ceramics, concrete, etc. And during long-term use, the wear rate is slow, and the service life is long.
High Cutting Precision: It can achieve high-precision cutting. The cut is neat and smooth, and the wear of the cutting section is small, with a small amount of material removed. It can meet the application requirements with high precision for cutting, such as semiconductor processing, optical element manufacturing, etc.
Fast Cutting Speed: Thanks to its high hardness and sharp cutting edge, the diamond cutting slice can maintain a high linear speed during the cutting process, improving the cutting efficiency and shortening the processing time.

Construction and Building Materials Industry: Widely used for cutting construction materials such as concrete, bricks, and stone. For example, cutting concrete components during construction and cutting and shaping marble, granite, etc. in stone processing.
Semiconductor Industry: Used for cutting semiconductor wafers, such as monocrystalline silicon, silicon carbide, etc., providing high-precision wafer slices for processes like chip manufacturing.
Metallographic Analysis: In metallographic laboratories, it is used for cutting and sampling metal materials, so as to conduct subsequent metallographic observation, analysis, and research, helping to evaluate the organizational structure, performance, etc. of the materials.
Ceramics and Glass Processing: It can precisely cut ceramic products and glass, and is used for producing ceramic plates, glass handicrafts, etc., meeting the processing requirements of different shapes and sizes.